TT Electronics/IRC

GS8B026651BAT

GS8B026651BAT Description

The GS8B026651BAT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring tight tolerance and stability. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 6.65KΩ resistance value and an exceptional ±0.1% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures minimal drift across the -70°C to +125°C operating range, making it suitable for precision analog and digital circuits. The SOIC-C series construction offers robust performance with a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, ideal for space-constrained designs.

GS8B026651BAT Features

• High Precision: ±0.1% absolute tolerance and ±0.05% ratio tolerance for critical signal conditioning.
• Stable Performance: Thin-film technology with ±50ppm/°C thermal stability.
• Durable Construction: Ceramic case and gull-wing termination for reliable surface-mount assembly.
• Compact Design: 9.91mm × 5.99mm × 1.45mm footprint with tight dimensional tolerances (±0.1mm height).
• Wide Operating Range: Derated power up to 125°C, suitable for industrial environments.
• Bussed Configuration: Simplifies PCB layout for bus line termination or voltage division.

GS8B026651BAT Applications

This resistor network excels in:

• Precision Instrumentation: Medical devices, test equipment, and sensor interfaces requiring low drift.
• Automotive Electronics: Engine control units (ECUs) and infotainment systems (though not PPAP-certified).
• Communication Systems: Signal conditioning in RF modules and data converters.
• Industrial Controls: PLCs and motor drives where temperature resilience is critical.

Conclusion of GS8B026651BAT

The GS8B026651BAT stands out for its combination of precision, stability, and compactness, making it a superior choice for engineers designing high-reliability circuits. Its ceramic substrate and thin-film technology deliver consistent performance under thermal stress, while the bussed architecture reduces component count. Though not automotive-grade or RoHS-compliant, it remains a cost-effective solution for industrial and telecom applications demanding tight-tolerance resistance networks.