TT Electronics/IRC

GS8B026652CT

GS8B026652CT Description

The GS8B026652CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 66.5KΩ resistance value and an exceptional ±0.25% absolute tolerance. Built using thin-film technology, this network delivers ±50ppm/°C temperature coefficient stability, ensuring reliable performance across a 70°C to 125°C operating range. With a 0.05W (1/20) power rating per resistor and a 100V maximum voltage rating, it is engineered for precision signal conditioning, voltage division, and impedance matching in compact PCB layouts.

GS8B026652CT Features

• High Precision: Tight ±0.25% tolerance and ±50ppm/°C TCR for stable performance in variable temperatures.
• Robust Construction: Ceramic case and SOIC package ensure durability and thermal stability.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm dimensions with 1.27mm terminal pitch for high-density designs.
• Bussed Configuration: 15 resistors share a common node (BUS), simplifying circuit routing.
• Surface-Mount Ready: Gull-wing termination for automated assembly compatibility.
• Wide Operating Range: Rated for 125°C maximum temperature and derated power up to 125°C.

GS8B026652CT Applications

• Precision Analog Circuits: Ideal for DAC/ADC reference networks, feedback loops, and sensor interfaces.
• Industrial Electronics: Suitable for PLC modules, instrumentation, and control systems requiring stable resistance.
• Automotive & Aerospace (non-Automotive PPAP): Used in avionics and telematics where temperature resilience is critical.
• Medical Devices: Ensures accuracy in patient monitoring equipment and diagnostic tools.
• Communication Systems: Supports impedance matching in RF and signal processing PCBs.

Conclusion of GS8B026652CT

The GS8B026652CT stands out for its precision, compactness, and thermal stability, making it a superior choice for applications demanding low tolerance and high reliability. Its bussed design reduces component count, while the ceramic SOIC package enhances durability in harsh environments. Though not RoHS-compliant and unconfirmed for PPAP, it remains a cost-effective solution for industrial, medical, and communication systems where performance outweighs regulatory constraints.