TT Electronics/IRC

GS8B0269R8JT

GS8B0269R8JT Description

The GS8B0269R8JT from TT Electronics/IRC is a ceramic-based resistor network designed for precision applications requiring stable performance in demanding environments. This 16-pin Narrow SOIC device features 15 bussed resistors with a 69.8Ω resistance value and a ±5% tolerance, ensuring reliable signal distribution in bus-oriented circuits. Built with thin-film technology, it delivers a low ±50ppm/°C temperature coefficient, minimizing resistance drift across its operating range of -70°C to +125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) offers a compact footprint with gull-wing terminations for robust surface-mount assembly. Rated for 100V maximum voltage and 0.8W total power dissipation, it combines durability with high-density integration.

GS8B0269R8JT Features

• High Stability: Thin-film construction ensures consistent performance under thermal stress (±50ppm/°C).
• Space-Efficient: 16-pin SOIC package (narrow profile) optimizes PCB real estate.
• Bussed Configuration: 15 resistors share a common node, simplifying bus line designs.
• Robust Power Handling: 0.05W per resistor (0.8W total) supports moderate current loads.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power at elevated temperatures.
• Precision Tolerance: ±5% absolute tolerance for balanced signal distribution.
• Non-Automotive Grade: Suitable for industrial/commercial applications where PPAP compliance is not required.

GS8B0269R8JT Applications

Ideal for voltage division, pull-up/pull-down networks, and bus termination in:

• Industrial Control Systems: PLCs, sensor interfaces requiring stable resistance under thermal cycling.
• Telecommunications Equipment: Signal conditioning in high-density PCBs.
• Test & Measurement Devices: Precision circuits demanding low TCR and tight tolerance.
• Consumer Electronics: Compact designs needing reliable resistor arrays (e.g., audio/video hardware).

Conclusion of GS8B0269R8JT

The GS8B0269R8JT excels in applications requiring miniaturization, thermal stability, and simplified bus routing. Its ceramic substrate and thin-film technology provide superior reliability over thick-film alternatives, while the SOIC package ensures compatibility with automated assembly processes. Though not RoHS-compliant, it remains a cost-effective solution for non-regulated markets. Engineers will value its balance of precision, power handling, and space savings in complex circuit designs.