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GS8B0278R7GDT
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GS8B0278R7GDT Description
GS8B0278R7GDT Description
The GS8B0278R7GDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 78.7Ω resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a ±50ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The SOIC-C series package provides robust mechanical integrity, with a compact footprint (9.91mm × 5.99mm × 1.45mm) and gull-wing terminations for reliable surface-mount assembly. Rated for 100V maximum voltage and 0.05W power dissipation per resistor, it operates within a -70°C to +125°C temperature range, derated for high-temperature conditions.
GS8B0278R7GDT Features
- Bussed Network Design: Simplifies circuit layout with 15 interconnected resistors.
- High Precision: ±2% absolute tolerance and ±0.5% ratio tolerance for matched performance.
- Stable Thin-Film Technology: Delivers low noise and superior thermal stability (±50ppm/°C).
- Robust Construction: Ceramic case ensures durability and heat dissipation.
- Surface-Mount Ready: Gull-wing terminations and 1.27mm pitch for easy PCB integration.
- Wide Operating Range: Functions reliably from -70°C to +125°C, ideal for industrial and automotive (non-PPAP) applications.
- Compact SOIC Package: Space-saving design with 9.91mm length and 1.45mm height.
GS8B0278R7GDT Applications
This resistor network excels in precision voltage division, bus termination, and pull-up/pull-down circuits in:
- Industrial Control Systems: Stable performance in harsh environments.
- Telecommunications Equipment: Reliable signal conditioning.
- Test & Measurement Devices: Low drift ensures accuracy.
- Consumer Electronics: Compact size suits high-density PCBs.
- Power Management Circuits: Handles derated power up to 125°C.
Conclusion of GS8B0278R7GDT
The GS8B0278R7GDT stands out for its precision, thermal resilience, and compact form factor, making it a superior choice for applications demanding stable resistance networks. Its ceramic construction and thin-film technology provide long-term reliability, while the bussed design reduces component count. Though not RoHS-compliant or PPAP-certified, it remains a cost-effective solution for industrial and telecom systems requiring tight-tolerance performance. Engineers will appreciate its balance of size, accuracy, and power handling in space-constrained designs.



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