TT Electronics/IRC

GS8B0282R0GGT

GS8B0282R0GGT Description

The GS8B0282R0GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 resistors with a common 82Ω value, offering ±2% absolute tolerance and ±2% ratio tolerance. Built with thin-film technology, it delivers excellent stability with a low ±50ppm/°C temperature coefficient. The device operates across a wide temperature range (70°C to 125°C) and supports a maximum voltage rating of 100V, making it suitable for industrial and commercial applications. Its 0.05W (1/20) power rating per resistor and 0.8W total power rating ensure reliable performance in compact designs.

GS8B0282R0GGT Features

• Ceramic substrate for enhanced thermal and mechanical stability.
• Gull-wing termination for secure surface-mount (SMD) assembly.
• SOIC package (9.91mm × 5.99mm × 1.45mm) with tight tolerances (±0.1mm height/length).
• Bussed (BUS) configuration simplifies circuit design by connecting multiple resistors to a common node.
• Low TCR (±50ppm/°C) ensures minimal resistance drift under temperature fluctuations.
• Non-automotive grade (PPAP: No), ideal for industrial, telecom, and instrumentation use.
• Non-RoHS compliant, suitable for legacy or specialized applications.

GS8B0282R0GGT Applications

This resistor network excels in:

• Voltage divider circuits requiring precise ratio matching.
• Signal conditioning in data acquisition systems.
• Bus termination for digital communication interfaces (e.g., SPI, I²C).
• Industrial control systems where stability under thermal stress is critical.
• Embedded systems with space constraints, leveraging its compact SOIC footprint.

Conclusion of GS8B0282R0GGT

The GS8B0282R0GGT stands out for its robust ceramic construction, tight tolerance, and thermal resilience, making it a reliable choice for precision analog and mixed-signal designs. While not suited for automotive use, its bussed architecture and thin-film technology offer superior performance in industrial and communication applications. Engineers will appreciate its balance of miniaturization, power handling, and stability, particularly in environments with fluctuating temperatures.