TT Electronics/IRC

GS8B0282R0JGT

GS8B0282R0JGT Description

The GS8B0282R0JGT from TT Electronics/IRC is a high-reliability ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device integrates 15 bussed resistors with a 82Ω resistance value and ±5% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers a ±50ppm/°C temperature coefficient, making it stable across a wide temperature range (70°C to 125°C). The SOIC-C series package features gull-wing terminations for secure surface-mount (SMD) assembly, with a compact footprint of 9.91mm × 5.99mm × 1.45mm. Rated for 100V maximum voltage and 0.05W power per resistor (0.8W total), it is ideal for high-density PCB designs requiring robust signal integrity.

GS8B0282R0JGT Features

• Bussed Network Design: 15 resistors connected in a single bus configuration, simplifying circuit layout.
• High Stability: ±50ppm/°C TCR and ±2% ratio tolerance ensure minimal drift in harsh environments.
• Compact & Durable: Ceramic substrate and rectangular SOIC package provide mechanical strength and thermal resilience.
• Precision Termination: 1.27mm pitch gull-wing leads enable reliable soldering and automated placement.
• Wide Operating Range: Functions reliably from -55°C to +125°C (derated above 70°C).
• Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation applications where PPAP compliance is not required.

GS8B0282R0JGT Applications

• Voltage Division & Pull-Up/Down Networks: Ensures stable bias in analog/digital hybrid circuits.
• Signal Conditioning: Used in op-amp feedback networks and ADC/DAC interfaces.
• Power Supply Decoupling: Reduces noise in multi-channel power management ICs.
• Industrial Control Systems: Ideal for PLCs and sensor interfaces due to its high-voltage (100V) tolerance.
• Telecom Infrastructure: Supports signal integrity in RF modules and baseband processing units.

Conclusion of GS8B0282R0JGT

The GS8B0282R0JGT excels in applications demanding tight tolerance, thermal stability, and space efficiency. Its ceramic thin-film construction and bussed architecture offer superior performance over polymer-based networks, particularly in high-temperature or high-voltage scenarios. While not RoHS-compliant, it remains a cost-effective solution for non-consumer electronics where durability and precision are critical. Engineers will appreciate its balance of miniaturization, power handling, and ease of integration in complex PCB layouts.