TT Electronics/IRC

GS8B028660JDT

GS8B028660JDT Description

The GS8B028660JDT from TT Electronics/IRC is a high-reliability ceramic thin-film resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 866Ω resistance value and ±5% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stable performance across a 70°C to 125°C operating range, with a maximum voltage rating of 100V. The 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B028660JDT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology delivers high precision and low noise.
• Bussed network topology simplifies circuit design for common-node applications.
• Narrow SOIC (5.99mm × 9.91mm × 1.45mm) saves board space while maintaining robustness.
• ±0.5% ratio tolerance ensures consistent performance in matched-resistor applications.
• Wide temperature range (70°C to 125°C @ derated power) for harsh environments.
• Non-automotive, non-PPAP compliant, ideal for industrial and commercial use.

GS8B028660JDT Applications

This resistor network excels in:

• Voltage divider circuits requiring tight ratio tolerances.
• Signal conditioning in instrumentation and sensor interfaces.
• Bus termination for digital communication systems (e.g., SPI, I²C).
• Analog front-end modules where low TCR (±50ppm/°C) is critical.
• Power management circuits in medical and test equipment.

Conclusion of GS8B028660JDT

The GS8B028660JDT combines precision, compactness, and reliability, making it a standout choice for dense, high-performance PCBs. Its ceramic construction and thin-film technology offer superior stability over alternatives, while the bussed design reduces component count. Though not RoHS-compliant, it remains a robust solution for industrial and commercial electronics demanding tight tolerances and thermal resilience.