TT Electronics/IRC

GS8B028662FFT

GS8B028662FFT Description

The GS8B028662FFT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin Narrow SOIC device features 15 bussed resistors with a 86.6KΩ resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±1%. Built with thin-film technology, it ensures stable performance across a wide temperature range (70°C to 125°C) and a low temperature coefficient of ±50ppm/°C. The SOIC-C series package provides a compact footprint (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations for reliable surface-mount assembly. Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for precision analog and digital circuits.

GS8B028662FFT Features

• Bussed Network Design: 15 resistors connected in a bus configuration for simplified circuit layout.
• High Precision: ±1% tolerance and ±50ppm/°C TCR ensure consistent performance in varying conditions.
• Robust Construction: Ceramic substrate enhances thermal stability and durability.
• Compact SOIC Package: Space-saving 16-pin Narrow SOIC (9.91mm x 5.99mm) with 1.27mm terminal pitch.
• Wide Operating Range: Supports -55°C to +125°C with derated power up to 125°C.
• Surface-Mount Ready: Gull-wing terminations facilitate automated PCB assembly.
• Non-Automotive/Non-PPAP: Suitable for industrial and commercial applications.

GS8B028662FFT Applications

• Voltage Division Circuits: Precision dividers in measurement equipment.
• Signal Conditioning: Analog front-ends for sensors and data acquisition systems.
• Digital Logic Buffering: Pull-up/pull-down networks in microcontrollers and FPGAs.
• Power Management: Current limiting and bias networks in DC-DC converters.
• Industrial Controls: Robust performance in harsh environments (e.g., PLCs, motor drives).

Conclusion of GS8B028662FFT

The GS8B028662FFT combines high precision, thermal resilience, and compact design, making it a superior choice for engineers seeking reliability in industrial, medical, and communication systems. Its bussed architecture reduces component count, while the ceramic substrate ensures longevity under thermal stress. While not PPAP or automotive-qualified, it excels in commercial and industrial electronics where accuracy and space efficiency are critical.