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GS8B031022GAT
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GS8B031022GAT Description
GS8B031022GAT Description
The GS8B031022GAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 10.2KΩ resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. The SOIC package (9.91mm x 5.99mm x 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for reliable PCB connections. Rated for 100V maximum voltage and 0.05W power dissipation per resistor, it operates reliably within a 70°C to 125°C derated power range.
GS8B031022GAT Features
- Ceramic substrate for enhanced thermal and mechanical stability.
- Bussed network topology simplifies circuit design in multi-resistor applications.
- Low TCR (±25ppm/°C) ensures minimal resistance drift under temperature variations.
- High power rating (0.8W total, 0.05W per resistor) for robust performance.
- Narrow SOIC (SOIC-C) package saves board space while maintaining durability.
- 2% absolute tolerance and ±0.05% ratio tolerance for precision matching.
- Wide operating temperature range (-55°C to +125°C) suits harsh environments.
- Non-automotive (PPAP: No) but suitable for industrial and instrumentation use.
GS8B031022GAT Applications
This resistor network excels in:
- Analog signal conditioning circuits requiring stable, matched resistances.
- Voltage dividers and pull-up networks in embedded systems.
- Precision instrumentation (e.g., data acquisition, sensor interfaces).
- Medical electronics where consistent performance is critical.
- Industrial control systems demanding reliability under thermal stress.
Conclusion of GS8B031022GAT
The GS8B031022GAT stands out for its ceramic construction, tight tolerances, and low TCR, making it a superior choice for precision electronics. Its compact SOIC package and bussed design reduce component count and simplify layouts, while the thin-film technology ensures long-term stability. Though not PPAP-certified, it is well-suited for industrial, medical, and high-reliability applications where accuracy and thermal performance are paramount. Engineers will appreciate its balance of size, power handling, and resistance consistency in demanding circuits.



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