TT Electronics/IRC

GS8B031101JDT

GS8B031101JDT Description

The GS8B031101JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, it features 15 bussed resistors with a 1.1KΩ resistance value and a ±5% absolute tolerance. The device leverages thin-film technology for superior stability, offering a low temperature coefficient of ±25ppm/°C and a power rating of 0.05W (1/20) per resistor (0.8W total). Its SOIC-C series construction ensures robust performance in demanding environments, with a maximum operating temperature of 125°C and a voltage rating of 100V. The gull-wing termination and surface-mount design facilitate easy integration into compact PCB layouts.

GS8B031101JDT Features

• Ceramic Case: Enhances thermal and mechanical durability.
• Bussed Network: Simplifies circuit design with shared connections.
• Low TCR (±25ppm/°C): Ensures minimal resistance drift across temperatures.
• High Power Handling: 0.8W total dissipation for reliable operation.
• Precision Tolerance: ±5% absolute, ±0.5% ratio tolerance for matched performance.
• SOIC Package: Compact 9.91mm × 5.99mm × 1.45mm footprint with ±0.1mm dimensional tolerances.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power.

GS8B031101JDT Applications

Ideal for analog signal conditioning, voltage division, and impedance matching in:

• Industrial Control Systems: Where stability and precision are critical.
• Automotive Electronics: Non-automotive grade but suitable for benign environments.
• Test & Measurement Equipment: Demanding low TCR and tight tolerance.
• Consumer Electronics: Compact designs requiring reliable resistor networks.
• Power Management Circuits: Leveraging its high voltage rating and thermal resilience.

Conclusion of GS8B031101JDT

The GS8B031101JDT stands out for its ceramic construction, thin-film accuracy, and bussed topology, making it a versatile choice for precision circuits. While not PPAP or automotive-grade, its low TCR, high power rating, and robust packaging cater to industrial and consumer applications where reliability is paramount. Engineers will appreciate its ease of integration and consistent performance in temperature-variable environments.