TT Electronics/IRC

GS8B031131GDT

GS8B031131GDT Description

The GS8B031131GDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 1.13KΩ resistance and a tight ±2% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures minimal resistance drift across a wide operating temperature range of 70°C to 125°C, making it suitable for stable performance in variable environments. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for automated PCB assembly. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling and compactness.

GS8B031131GDT Features

• Precision Thin-Film Technology: Delivers ±0.5% ratio tolerance for matched resistor performance in differential circuits.
• Robust Ceramic Package: Enhances thermal stability and mechanical durability vs. polymer-based networks.
• Space-Efficient SOIC Design: 9.91mm length × 5.99mm depth × 1.45mm height with ±0.1mm dimensional tolerances for high-density layouts.
• Bussed Configuration: Simplifies bus line termination in digital systems (e.g., I²C, SPI).
• Wide Temperature Range: Operates reliably up to 125°C, ideal for industrial and automotive-adjacent applications (though not PPAP/automotive-certified).
• Low TCR (±25ppm/°C): Outperforms thick-film networks (±100ppm/°C+) in precision analog circuits.

GS8B031131GDT Applications

• Voltage Divider Networks: Precision reference circuits in ADCs/DACs.
• Bus Termination: Signal integrity for high-speed digital lines (e.g., memory buses).
• Sensor Conditioning: Stable biasing for thermocouples or strain gauges.
• Medical/Test Equipment: Where low drift and repeatability are critical.
• Industrial Controls: PLCs and motor drives requiring rugged, temperature-stable components.

Conclusion of GS8B031131GDT

The GS8B031131GDT excels in applications demanding tight tolerance, low thermal drift, and compact footprint. Its ceramic SOIC package and thin-film technology offer superior performance over standard thick-film arrays, particularly in precision analog or high-reliability systems. While not automotive-grade, its 125°C rating and bussed design make it a versatile choice for industrial, communications, and instrumentation designs. Engineers should verify EU RoHS non-compliance for regulatory alignment.