TT Electronics/IRC

GS8B031132JBT

GS8B031132JBT Description

The GS8B031132JBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 11.3KΩ resistance value and a ±5% absolute tolerance. The device operates within a temperature range of 70°C to 125°C and offers a low temperature coefficient of ±25ppm/°C, ensuring stable performance under thermal stress. With a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V, it is engineered for reliability in demanding circuits. The thin-film technology provides superior accuracy, while the gull-wing termination ensures secure surface mounting.

GS8B031132JBT Features

• High Precision: ±5% absolute tolerance and ±0.1% ratio tolerance for critical signal conditioning.
• Robust Construction: Ceramic case and thin-film resistors enhance durability and thermal stability.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm SOIC package ideal for high-density PCB layouts.
• Wide Operating Range: Supports -55°C to +125°C (derated power up to 125°C).
• Low TCR: ±25ppm/°C minimizes resistance drift across temperature fluctuations.
• Automated Assembly Compatible: Gull-wing leads and 1.27mm terminal pitch facilitate pick-and-place processes.

GS8B031132JBT Applications

This resistor network excels in:

• Voltage Divider Networks: Precision ratio tolerance (±0.1%) ensures accurate signal scaling.
• Industrial Control Systems: Stable performance in harsh environments (e.g., motor drives, PLCs).
• Test & Measurement Equipment: Low TCR and tight tolerances meet calibration requirements.
• Power Management Circuits: Bussed design simplifies bus termination and pull-up/pull-down configurations.
• Aerospace & Defense: Ceramic construction withstands mechanical stress and thermal cycling.

Conclusion of GS8B031132JBT

The GS8B031132JBT combines precision, reliability, and compactness, making it a superior choice for applications demanding tight tolerance and thermal stability. Its ceramic thin-film technology and SOIC packaging offer a competitive edge over polymer-based networks, particularly in high-temperature or precision-critical environments. While not RoHS-compliant, its performance metrics cater to specialized industrial and aerospace needs where durability outweighs regulatory constraints. Ideal for engineers prioritizing accuracy, power efficiency, and space optimization in circuit design.