TT Electronics/IRC

GS8B031151GT

GS8B031151GT Description

The GS8B031151GT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration device integrates 15 thin-film resistors, each with a 1.15 kΩ resistance and a tight ±2% tolerance. Its ±25 ppm/°C temperature coefficient ensures stability across a wide operating range (70°C to 125°C), while the 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-reliability circuits. The SOIC-C series construction features gull-wing termination for robust surface-mount assembly, with a compact footprint (9.91mm × 5.99mm × 1.45mm) and ±0.1mm dimensional tolerances for precise PCB integration.

GS8B031151GT Features

• High Stability: Thin-film technology with ±25 ppm/°C TCR minimizes resistance drift under thermal stress.
• Compact & Robust: Ceramic case and rectangular SOIC package offer mechanical durability and space savings.
• Precision Performance: 2% absolute tolerance and bussed topology simplify circuit design for voltage division or pull-up/down networks.
• Wide Operating Range: Derated power up to 125°C, ideal for industrial or automotive-adjacent environments (non-automotive PPAP).
• Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads ensure compatibility with automated assembly processes.

GS8B031151GT Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces or ADC/DAC circuits.
• Pull-Up/Down Networks: Bus termination for I²C, SPI, or other digital communication lines.
• Industrial Controls: Stable resistance in PLCs, motor drives, or power management PCBs.
• Test & Measurement Equipment: Low-noise, stable reference networks in calibration systems.
• Consumer Electronics: Space-constrained designs requiring multi-resistor integration (e.g., audio hardware).

Conclusion of GS8B031151GT

The GS8B031151GT excels in applications demanding tight tolerance, thermal stability, and compact integration. Its ceramic construction and thin-film technology provide superior reliability over carbon-composite alternatives, while the bussed design reduces component count in bus-heavy architectures. Though not RoHS-compliant or PPAP-certified, it remains a cost-effective solution for industrial, telecom, and precision electronics where environmental regulations permit. Engineers will value its repeatable performance and ease of assembly in high-density PCB layouts.