TT Electronics/IRC

GS8B031331FBT

GS8B031331FBT Description

The GS8B031331FBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 resistors with a 1.33KΩ resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±0.1%. Its thin-film technology ensures stability, with a low temperature coefficient of ±25ppm/°C, making it suitable for environments with operating temperatures ranging from 70°C to 125°C. The device features a 0.05W (1/20) power rating per resistor and a total power rating of 0.8W, housed in a rectangular ceramic case with gull-wing terminations for reliable surface-mount (SMD) assembly.

GS8B031331FBT Features

• Precision Performance: ±1% absolute tolerance and ±0.1% ratio tolerance ensure consistent signal integrity.
• Robust Construction: Ceramic substrate enhances thermal stability and durability.
• Wide Voltage Range: Supports up to 100V maximum voltage rating.
• Temperature Resilience: Operates reliably from 70°C to 125°C with derated power.
• Compact & Reliable: SOIC package (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Low TCR: ±25ppm/°C minimizes resistance drift under thermal stress.
• Bussed Configuration: Simplifies PCB layout for bus line applications.

GS8B031331FBT Applications

Ideal for precision circuits requiring stable resistance networks, such as:

• Analog/Digital Signal Conditioning: Voltage dividers, feedback networks in op-amps.
• Industrial Controls: PLCs, sensor interfaces, and instrumentation.
• Telecommunications: Impedance matching and line termination.
• Automotive & Aerospace (non-AECQ): Non-safety-critical systems where ceramic reliability is preferred.
• Test & Measurement Equipment: Calibration circuits and reference networks.

Conclusion of GS8B031331FBT

The GS8B031331FBT excels in high-precision, thermally stable applications, leveraging its ceramic construction, tight tolerances, and low TCR. While not PPAP or automotive-grade, its bussed design and SOIC footprint make it a versatile choice for industrial and telecom systems. Engineers will appreciate its balance of performance, compactness, and reliability in critical signal-path applications.