TT Electronics/IRC_GS8B031372FBT
original

TT Electronics/IRC
GS8B031372FBT

50-GS8B031372FBT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,16-Pin Narrow SOIC, Bussed elements,±25ppm/°C, 13.7KOhm, absolute tolerance ±1%, ratio tolerance ±0.1%
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Tech Specifications

Circuit Designator
BUS
Number of Resistors
15
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS8B031372FBT Description

GS8B031372FBT Description

The GS8B031372FBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 13.7KΩ resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±0.1%. Built with thin-film technology, this network ensures low temperature coefficient (±25ppm/°C) and stable performance across a wide temperature range (70°C to 125°C). The SOIC package provides excellent thermal and mechanical stability, with a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V.

GS8B031372FBT Features

  • High Precision: ±1% absolute tolerance and ±0.1% ratio tolerance for accurate signal conditioning.
  • Stable Performance: ±25ppm/°C temperature coefficient ensures minimal drift in varying environments.
  • Robust Construction: Ceramic case enhances durability and thermal dissipation.
  • Space-Efficient: 9.91mm × 5.99mm × 1.45mm compact footprint with gull-wing termination for easy surface-mount assembly.
  • Wide Operating Range: Suitable for -55°C to +125°C, with derated power up to 125°C.
  • Bussed Configuration: Simplifies circuit design in bus termination, pull-up/pull-down networks, and voltage dividers.

GS8B031372FBT Applications

This resistor network is ideal for:

  • Analog/Digital Signal Processing: Precision voltage division and impedance matching in ADCs, DACs, and sensor interfaces.
  • Industrial Electronics: PLC systems, motor controls, and power management circuits requiring stable resistance under thermal stress.
  • Communications Equipment: Bus termination in high-speed data lines (e.g., CAN, I2C, SPI).
  • Automotive & Aerospace: Non-automotive but suitable for avionics and instrumentation due to its high reliability and low drift.

Conclusion of GS8B031372FBT

The GS8B031372FBT stands out for its precision, thermal stability, and compact SOIC packaging, making it a superior choice for high-performance circuits. While not PPAP or automotive-qualified, its ceramic construction and thin-film technology ensure longevity in industrial, telecom, and precision instrumentation applications. Engineers will appreciate its tight tolerances, low TCR, and bussed design, which reduce component count and improve system reliability.

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