TT Electronics/IRC

GS8B031402BBT

GS8B031402BBT Description

The GS8B031402BBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring tight tolerance and stability. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 14KΩ resistance and an absolute tolerance of ±0.1%. The device operates over a wide temperature range (70°C to 125°C) with a low temperature coefficient (±25ppm/°C), ensuring minimal resistance drift. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, offering robust performance in compact designs.

GS8B031402BBT Features

• High Precision: ±0.1% absolute tolerance and ±0.1% ratio tolerance for critical signal conditioning.
• Stable Performance: Thin-film technology with ±25ppm/°C TCR ensures reliability under thermal stress.
• Robust Construction: Ceramic case (SOIC package) with 9.91mm length, 5.99mm depth, and 1.45mm height (±0.1mm tolerance).
• Bussed Design: 15 resistors interconnected for simplified PCB layout in bus-oriented applications.
• Wide Operating Range: Supports -55°C to +125°C with derated power up to 125°C.
• Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads for automated assembly.

GS8B031402BBT Applications

• Precision Voltage Dividers: Ideal for ADC/DAC reference circuits due to low tolerance and drift.
• Industrial Control Systems: Stable performance in PLCs, sensors, and instrumentation.
• Medical Electronics: Suitable for diagnostic equipment where accuracy is critical.
• Automotive (Non-Automotive Rated): Auxiliary systems requiring robust, temperature-stable resistors.
• Telecom Infrastructure: Signal conditioning in high-reliability RF and baseband circuits.

Conclusion of GS8B031402BBT

The GS8B031402BBT excels in applications demanding high precision, thermal stability, and compact form factors. Its ceramic SOIC package, thin-film resistors, and bussed architecture provide superior performance over standard thick-film networks. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial, medical, and telecom systems where tight tolerance (±0.1%) and low TCR (±25ppm/°C) are paramount. Engineers will appreciate its ease of integration and reliability in mission-critical designs.