TT Electronics/IRC

GS8B031501JFT

GS8B031501JFT Description

The GS8B031501JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C Series), it features 15 bussed resistors with a 1.5KΩ resistance value and a ±5% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C with a low temperature coefficient of ±25ppm/°C, ensuring stable performance under thermal stress. Its thin-film technology delivers superior accuracy and reliability, while the 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits. The 100V maximum voltage rating and gull-wing termination ensure compatibility with surface-mount (SMD) assembly processes.

GS8B031501JFT Features

• Ceramic case for enhanced durability and thermal stability.
• Bussed network (BUS) configuration simplifies circuit design.
• ±1% ratio tolerance for matched resistor performance.
• Compact dimensions: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height, ±0.2mm depth).
• 1.27mm terminal pitch for high-density PCB layouts.
• Non-automotive (PPAP: No) but ideal for industrial and telecom applications.
• Thin-film technology ensures low noise and high precision.

GS8B031501JFT Applications

This resistor network excels in:

• Voltage dividers and pull-up/pull-down networks in digital circuits.
• Signal conditioning for sensors and ADCs in test/measurement equipment.
• Industrial control systems requiring stable resistance over temperature.
• Telecommunication infrastructure where precision and reliability are critical.
• Embedded systems with space constraints due to its SOIC footprint.

Conclusion of GS8B031501JFT

The GS8B031501JFT stands out for its ceramic construction, tight tolerances, and bussed design, offering a robust solution for precision analog and digital circuits. Its thin-film technology and low TCR make it superior to thick-film alternatives in demanding environments. While not RoHS-compliant, it remains a top choice for industrial, telecom, and instrumentation applications where performance outweighs regulatory constraints. Its SOIC package ensures compatibility with automated assembly, reducing manufacturing costs.