TT Electronics/IRC

GS8B031651JAT

GS8B031651JAT Description

The GS8B031651JAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed (BUS) network integrates 15 thin-film resistors, each with a 1.65 kΩ resistance and a ±5% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C with a low temperature coefficient of ±25 ppm/°C, ensuring stable performance under thermal stress. Its 0.05W (1/20) power rating per resistor and 0.8W total power dissipation make it suitable for low-power, high-density designs. The gull-wing termination and surface-mount (SOIC) ceramic case provide robust mechanical and electrical reliability.

GS8B031651JAT Features

• Precision Thin-Film Technology: Delivers ±25 ppm/°C thermal stability and ±0.05% ratio tolerance for matched resistance performance.
• Robust Construction: Ceramic substrate enhances thermal management and durability in harsh environments.
• High Voltage Handling: Supports up to 100V, ideal for industrial and automotive-grade applications (though not PPAP/automotive-certified).
• Compact & Reliable: 9.91mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances ensure consistent PCB integration.
• Bussed Network Design: Simplifies circuit layout by connecting multiple resistors to a common node, reducing component count.

GS8B031651JAT Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces and ADC/DAC circuits.
• Industrial Controls: Feedback networks in power supplies and motor drivers, leveraging its 125°C max operating temperature.
• Test & Measurement Equipment: High-accuracy resistor arrays for calibration and reference circuits.
• Consumer Electronics: Space-constrained designs requiring stable, low-power resistor networks (e.g., audio processing).

Conclusion of GS8B031651JAT

The GS8B031651JAT excels in applications demanding thermal stability, precision, and compactness. Its ceramic SOIC package, bussed architecture, and thin-film technology offer superior performance over plastic-encased networks, particularly in environments with thermal cycling or voltage fluctuations. While not RoHS-compliant or automotive-qualified, it remains a cost-effective solution for industrial and instrumentation designs requiring reliable, high-density resistor networks.