TT Electronics/IRC

GS8B031802CCT

GS8B031802CCT Description

The GS8B031802CCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration network integrates 15 thin-film resistors, each with a 18KΩ resistance and an exceptional ±0.25% absolute tolerance. The device operates over a wide temperature range (-70°C to +125°C) with a low ±25ppm/°C temperature coefficient, ensuring stability in harsh environments. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, meeting industry-standard reliability requirements.

GS8B031802CCT Features

• High Precision: ±0.25% tolerance and ±25ppm/°C TCR for critical signal conditioning.
• Robust Construction: Ceramic substrate ensures thermal stability and mechanical durability.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch.
• Bussed Design: Simplified PCB layout with shared common connections (BUS topology).
• Wide Operating Range: Derated power up to 125°C, ideal for industrial and automotive (non-PPAP) applications.
• Thin-Film Technology: Delivers low noise and high accuracy compared to thick-film alternatives.

GS8B031802CCT Applications

• Analog Signal Processing: Voltage dividers, DAC/ADC reference networks.
• Industrial Controls: PLCs, sensor interfaces requiring drift-resistant resistors.
• Test & Measurement Equipment: Precision instrumentation where ratio tolerance (±0.25%) is critical.
• Power Management: Feedback networks in DC-DC converters or LDO regulators.
• Aerospace & Defense: Non-RoHS compliant variants for legacy systems.

Conclusion of GS8B031802CCT

The GS8B031802CCT excels in applications demanding tight tolerance, thermal stability, and compact integration. Its ceramic thin-film design outperforms standard networks in precision and reliability, while the bussed architecture reduces component count. Though not PPAP-capable or automotive-grade, it is a cost-effective solution for industrial, medical, and high-reliability electronics. Engineers will appreciate its balance of performance, size, and ruggedness in mission-critical designs.