
TT Electronics/IRC
GS8B031911FBT
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GS8B031911FBT Description
GS8B031911FBT Description
The GS8B031911FBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 1.91KΩ resistance value and a tight ±1% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The SOIC-C series package provides robust mechanical protection, while the gull-wing termination ensures reliable surface-mount assembly. With a power rating of 0.8W (0.05W per resistor) and a maximum operating temperature of 125°C, this network is engineered for durability in compact designs.
GS8B031911FBT Features
- High Precision: ±1% absolute tolerance and ±0.1% ratio tolerance for critical signal conditioning.
- Stable Performance: Thin-film technology with ±25ppm/°C thermal drift ensures long-term reliability.
- Robust Construction: Ceramic case (SOIC) enhances thermal and mechanical resilience.
- Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint ideal for high-density PCBs.
- Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive (non-AECQ) applications.
- Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch simplify automated assembly.
GS8B031911FBT Applications
This resistor network excels in:
- Analog Signal Processing: Precision voltage dividers in sensor interfaces.
- Industrial Controls: Feedback networks in power supplies or motor drivers.
- Test & Measurement Equipment: Calibration circuits requiring low drift.
- Medical Electronics: High-reliability systems where stability is critical.
- Telecom Infrastructure: Signal conditioning in baseband or RF modules.
Conclusion of GS8B031911FBT
The GS8B031911FBT combines precision, stability, and compactness, making it a superior choice for applications demanding tight tolerances and thermal resilience. Its ceramic SOIC package and thin-film construction outperform standard epoxy-based networks in harsh environments. While not PPAP or automotive-qualified, it is ideal for industrial, medical, and telecom designs where accuracy and space constraints are paramount. Engineers will appreciate its balance of performance and manufacturability in surface-mount assemblies.



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