TT Electronics/IRC

GS8B031961JT

GS8B031961JT Description

The GS8B031961JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration integrates 15 thin-film resistors, each with a 1.96KΩ resistance and a tight ±5% tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in harsh environments. Its ±25ppm/°C temperature coefficient minimizes resistance drift, making it ideal for stable signal conditioning. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compactness (9.91mm x 5.99mm x 1.45mm) with robust performance.

GS8B031961JT Features

• High-Density Integration: 15 resistors in a compact SOIC-16 footprint, reducing PCB space.
• Superior Stability: ±25ppm/°C TCR and ceramic substrate ensure minimal thermal drift.
• Bussed Design: Simplified circuit routing for common-node applications (e.g., pull-up/down networks).
• Robust Construction: Thin-film technology delivers precision, while the ceramic case enhances thermal and mechanical durability.
• Wide Operating Range: -70°C to +125°C with derated power, suited for automotive/industrial extremes (though not PPAP/AEC-Q200 qualified).
• Strict Tolerances: ±5% absolute tolerance and ±0.1mm height/length tolerances for consistent SMD placement.

GS8B031961JT Applications

• Signal Conditioning: Voltage dividers, ADC/DAC reference networks in test/measurement equipment.
• Industrial Controls: PLCs, sensor interfaces, and power management circuits requiring stable resistance.
• Consumer Electronics: Dense PCBs in smart home devices, where space and thermal performance are critical.
• Telecom Infrastructure: Line termination, impedance matching in high-frequency modules.
• Legacy Systems: Cost-effective upgrades for older designs needing reliable thru-hole alternatives (via adapters).

Conclusion of GS8B031961JT

The GS8B031961JT excels in applications demanding precision, thermal resilience, and space efficiency. Its ceramic thin-film design and bussed architecture offer distinct advantages over polymer-based networks, particularly in high-temperature or vibration-prone environments. While not automotive-grade, its 125°C rating and low TCR make it a versatile choice for industrial and consumer electronics. Engineers will appreciate its balance of performance, compactness, and cost, especially in designs requiring multiple matched resistors with minimal drift. For non-RoHS compliant projects, this model remains a robust alternative.