TT Electronics/IRC

GS8B032002FBT

GS8B032002FBT Description

The GS8B032002FBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring stable performance across a wide temperature range. This 16-pin narrow SOIC device features 15 bussed resistors with a 20KΩ resistance value, offering an absolute tolerance of ±1% and a ratio tolerance of ±0.1%. Built with thin-film technology, it ensures low noise and excellent thermal stability, characterized by a ±25ppm/°C temperature coefficient. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations is optimized for surface-mount assembly, supporting a maximum operating temperature of 125°C and a derated power range of 70°C to 125°C.

GS8B032002FBT Features

• High Precision: ±1% absolute tolerance and ±0.1% ratio tolerance for critical signal conditioning.
• Robust Construction: Ceramic case ensures durability and thermal performance.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and instrumentation use.
• Low TCR: ±25ppm/°C minimizes resistance drift under thermal stress.
• Optimized Power Handling: 0.05W per resistor (0.8W total) with derating up to 125°C.
• Surface-Mount Design: 1.27mm terminal pitch and SOIC footprint for compact PCB layouts.
• Non-Automotive: Ideal for non-PPAP applications like test equipment and telecom.

GS8B032002FBT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks in op-amps.
• Industrial Controls: Sensor signal conditioning, PLCs.
• Test & Measurement: Calibration equipment, data acquisition systems.
• Telecom Infrastructure: Line termination, impedance matching.
• Medical Devices: Low-noise signal paths where stability is critical.

Conclusion of GS8B032002FBT

The GS8B032002FBT combines high accuracy, thermal resilience, and compact packaging, making it a superior choice for precision electronics. Its thin-film construction and tight tolerances outperform generic arrays in critical applications, while the SOIC form factor ensures compatibility with automated assembly. Though not RoHS-compliant, it remains a reliable solution for industrial and professional-grade designs requiring long-term stability under thermal cycling.