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GS8B032052FT
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GS8B032052FT Description
GS8B032052FT Description
The GS8B032052FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 20.5KΩ resistance value and a tight ±1% absolute tolerance. Built using thin-film technology, this network ensures excellent stability with a low temperature coefficient of ±25ppm/°C, making it ideal for environments with fluctuating thermal conditions. The device operates within a wide temperature range of -70°C to +125°C, with a derated power range of 70°C to 125°C, and supports a maximum voltage rating of 100V. Its 0.05W (1/20) power rating per resistor and 0.8W total power rating ensure reliable performance in compact, high-density circuits.
GS8B032052FT Features
- Ceramic substrate for enhanced thermal and mechanical stability.
- Gull-wing termination for secure surface-mount (SMD) assembly.
- Precision thin-film resistors with ±1% tolerance and ±25ppm/°C TCR.
- Bussed network (BUS) configuration simplifies circuit design.
- SOIC package (9.91mm x 5.99mm x 1.45mm) with ±0.1mm length/height tolerances for consistent PCB integration.
- Non-automotive (PPAP: No) but suitable for industrial and telecom applications.
- Non-RoHS compliant; verify regulatory requirements before use.
GS8B032052FT Applications
This resistor network excels in:
- Precision voltage dividers and signal conditioning circuits.
- Industrial control systems requiring stable resistance under thermal stress.
- Telecommunication hardware (e.g., line drivers, filters).
- Test and measurement equipment demanding low drift and high accuracy.
- Power management modules where space-efficient, multi-resistor solutions are critical.
Conclusion of GS8B032052FT
The GS8B032052FT stands out for its ceramic construction, thin-film precision, and bussed topology, offering superior reliability in harsh environments. While not RoHS-compliant, its low TCR, tight tolerance, and robust SOIC package make it a preferred choice for engineers prioritizing performance over regulatory constraints. Ideal for industrial, telecom, and instrumentation designs, this network balances density, accuracy, and thermal resilience.



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