TT Electronics/IRC

GS8B032102GFT

GS8B032102GFT Description

The GS8B032102GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC package features 15 bussed resistors with a 21KΩ resistance value and a tight ±2% absolute tolerance. Built with thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, ensuring reliable performance across a 70°C to 125°C operating range. The SOIC-C series construction provides a compact footprint (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations for easy surface-mount assembly. Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for space-constrained designs requiring high accuracy and durability.

GS8B032102GFT Features

• Bussed Network Configuration: Simplifies circuit design with 15 interconnected resistors.
• Low TCR (±25ppm/°C): Ensures minimal resistance drift under thermal stress.
• High Power Handling: 0.05W per resistor (0.8W total) with derating up to 125°C.
• Precision Tolerance: ±2% absolute and ±1% ratio tolerance for matched performance.
• Robust Ceramic Substrate: Enhances thermal and mechanical stability vs. polymer-based networks.
• Narrow SOIC (SOIC-C) Package: Optimizes PCB space with 1.27mm pitch and 1.63mm seated height.
• Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation applications.

GS8B032102GFT Applications

• Voltage Divider Networks: Precision signal conditioning in ADCs/DACs.
• Bus Termination: Impedance matching in high-speed digital circuits (e.g., DDR memory).
• Sensor Interface Circuits: Stable biasing for RTDs or strain gauges.
• Industrial Control Systems: Reliable operation in harsh environments (70–125°C).
• Medical Electronics: Low-drift performance for diagnostic equipment.

Conclusion of GS8B032102GFT

The GS8B032102GFT stands out for its ceramic thin-film construction, low TCR, and bussed topology, making it superior to epoxy-based networks in thermal and electrical consistency. Its compact SOIC-C package and high-voltage tolerance cater to dense, high-reliability designs. While not RoHS-compliant, it excels in industrial and precision analog systems where stability and space efficiency are critical. Engineers should consider this model for applications demanding long-term accuracy and robustness under thermal cycling.