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GS8B032202DDT
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GS8B032202DDT Description
GS8B032202DDT Description
The GS8B032202DDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 thin-film resistors, each with a 22KΩ resistance and an absolute tolerance of ±0.5%. The device operates over a wide temperature range of -55°C to +125°C, with a derated power range of 70°C to 125°C, ensuring reliability in harsh environments. Its ±25ppm/°C temperature coefficient and 0.05W (1/20) power rating per resistor (0.8W total) make it suitable for precision analog and digital circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances thermal stability.
GS8B032202DDT Features
- High Precision: ±0.5% absolute and ratio tolerance for consistent performance.
- Robust Construction: Ceramic substrate with thin-film technology for low noise and high stability.
- Wide Voltage Rating: Supports up to 100V, ideal for industrial and automotive (non-AECQ) applications.
- Compact & Reliable: 9.91mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height/length).
- Thermal Resilience: Operates at 125°C max with derated power up to 125°C.
- Bussed Configuration: Simplifies circuit design for bus termination, pull-up/pull-down networks, and voltage dividers.
GS8B032202DDT Applications
- Industrial Controls: Precision signal conditioning in PLCs and sensors.
- Telecom Infrastructure: Impedance matching and termination in high-speed data lines.
- Test & Measurement Equipment: Stable reference networks for calibration.
- Power Management: Voltage divider networks in DC-DC converters.
- Non-Automotive Embedded Systems: Where EU RoHS non-compliance is permissible.
Conclusion of GS8B032202DDT
The GS8B032202DDT excels in applications requiring tight tolerance, thermal stability, and compact form factors. Its ceramic construction and thin-film technology offer superior performance over polymer-based networks, particularly in high-temperature or precision-critical environments. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial, telecom, and instrumentation designs. Engineers will appreciate its balance of precision, power handling, and space efficiency in complex PCB layouts.



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