TT Electronics/IRC

GS8B032320JDT

GS8B032320JDT Description

The GS8B032320JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), it features 15 bussed resistors with a 232Ω resistance value and a ±5% absolute tolerance. Its thin-film technology ensures stable performance, supported by a low ±25ppm/°C temperature coefficient for minimal resistance drift. The network operates within a wide temperature range of -55°C to +125°C, with derated power handling up to 125°C. The 0.05W (1/20W) power rating per resistor and 0.8W total power rating make it suitable for compact, high-density PCB designs.

GS8B032320JDT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Gull-wing termination for reliable surface-mount (SMD) assembly.
• Bussed circuit design simplifies routing in bus-line applications.
• ±0.5% ratio tolerance ensures matched resistance for precision circuits.
• 100V maximum voltage rating for robust performance in industrial environments.
• Compact dimensions (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Non-automotive (PPAP No) but ideal for industrial and telecom applications.

GS8B032320JDT Applications

This resistor network excels in:

• Voltage divider networks requiring tight ratio tolerances.
• Bus termination in digital communication systems (e.g., CAN, I2C).
• Signal conditioning for sensors and ADCs in measurement equipment.
• Power supply feedback circuits where stability is critical.
• Embedded systems needing space-saving, multi-resistor solutions.

Conclusion of GS8B032320JDT

The GS8B032320JDT stands out for its ceramic construction, precision tolerances, and bussed architecture, making it a superior choice for high-reliability electronics. While not RoHS-compliant, its thermal resilience and thin-film accuracy cater to demanding industrial and telecom applications. Engineers will appreciate its balance of compactness, performance, and ease of integration in complex PCB layouts.