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GS8B032490FT
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GS8B032490FT Description
GS8B032490FT Description
The GS8B032490FT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 249Ω resistance value and a tight ±1% tolerance, ensuring consistent performance in precision circuits. Built with thin-film technology, it delivers excellent stability with a low ±25ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The SOIC package (9.91mm × 5.99mm × 1.45mm) offers a compact footprint, ideal for space-constrained designs. With a power rating of 0.8W (0.05W per resistor) and a maximum operating temperature of 125°C, it balances efficiency and durability.
GS8B032490FT Features
- Bussed Network Configuration: Simplifies circuit design by connecting multiple resistors in a shared bus topology.
- High Precision: ±1% tolerance and ±25ppm/°C TCR ensure minimal drift in critical applications.
- Robust Construction: Ceramic case enhances thermal and mechanical stability.
- Surface-Mount Gull Wing Terminals: Facilitates automated PCB assembly with a 1.27mm pitch.
- Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive systems (non-automotive PPAP).
- Non-RoHS Compliant: Ideal for legacy or specialized applications requiring traditional materials.
GS8B032490FT Applications
This resistor network excels in:
- Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
- Industrial Control Systems: Stable resistance in PLCs and motor drivers.
- Test & Measurement Equipment: High-accuracy instrumentation.
- Power Management Circuits: Current limiting and feedback networks in DC/DC converters.
- Aerospace & Defense: Reliable performance in harsh environments (70°C to 125°C derated range).
Conclusion of GS8B032490FT
The GS8B032490FT combines precision, durability, and compact design, making it a standout choice for engineers needing reliable resistor networks. Its thin-film technology, bussed architecture, and ceramic encapsulation address challenges in thermal management and space efficiency. While not RoHS-compliant, it remains a robust solution for legacy or high-reliability systems. Ideal for industrial, instrumentation, and power applications, this component delivers consistent performance where accuracy and stability are paramount.



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