TT Electronics/IRC

GS8B032552DAT

GS8B032552DAT Description

The GS8B032552DAT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration integrates 15 thin-film resistors, each with a 25.5KΩ resistance and an exceptional ±0.5% absolute tolerance (±0.05% ratio tolerance). Its ±25ppm/°C temperature coefficient ensures stability across a wide operating range of -70°C to +125°C, making it suitable for environments with stringent thermal requirements. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compactness (9.91×5.99×1.45mm) with robust performance.

GS8B032552DAT Features

• Precision Thin-Film Technology: Delivers low TCR (±25ppm/°C) and tight tolerances (±0.5%) for critical signal conditioning.
• Ceramic Substrate: Enhances thermal management and durability vs. polymer-based networks.
• Bussed Design: Simplifies PCB layout by connecting multiple resistors to a common node (BUS).
• High-Temperature Resilience: Rated for 125°C continuous operation, derated up to 70°C.
• Compact SOIC Package: 16-pin narrow profile (1.27mm pitch) saves board space in dense designs.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation applications.

GS8B032552DAT Applications

• Analog Signal Processing: Voltage dividers, DAC/ADC reference networks.
• Medical Equipment: High-stability circuits in diagnostic devices.
• Test & Measurement: Calibration modules requiring ratio-matched resistors.
• Power Management: Feedback networks in DC-DC converters.
• Aerospace & Defense: Ruggedized electronics where temperature stability is critical.

Conclusion of GS8B032552DAT

The GS8B032552DAT excels in precision applications demanding low drift, high accuracy, and compact form factors. Its ceramic construction and thin-film technology outperform standard arrays in thermal and electrical consistency, while the bussed architecture reduces component count. Though not RoHS-compliant, it remains a top choice for industrial and high-reliability systems where performance outweighs regulatory constraints. Engineers will value its repeatability in matched-resistor networks and resilience in harsh operating conditions.