TT Electronics/IRC

GS8B032610JDT

GS8B032610JDT Description

The GS8B032610JDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 261Ω resistance value, offering a ±5% absolute tolerance and ±0.5% ratio tolerance for superior matching accuracy. Built with thin-film technology, it ensures excellent stability with a low ±25ppm/°C temperature coefficient. The SOIC-C series package provides robust performance in a compact 9.91mm × 5.99mm × 1.45mm footprint, making it ideal for space-constrained designs. Rated for 0.8W total power dissipation (0.05W per resistor) and 100V maximum voltage, it operates reliably across a -55°C to +125°C range, with derated power up to 125°C.

GS8B032610JDT Features

• Ceramic substrate for enhanced thermal and mechanical stability.
• Gull-wing termination ensures secure surface-mount attachment.
• Bussed network topology simplifies circuit design for common-bus applications.
• Low TCR (±25ppm/°C) minimizes resistance drift under temperature fluctuations.
• Narrow SOIC (SOIC-C) package optimizes PCB space efficiency.
• 1.27mm terminal pitch compatible with standard SMD assembly processes.
• Non-automotive grade with PPAP: No, suitable for industrial and commercial use.
• Non-RoHS compliant (contains lead), ideal for legacy or high-reliability systems.

GS8B032610JDT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage dividers and pull-up/pull-down networks in embedded systems.
• Signal conditioning for sensors and data acquisition modules.
• Bus termination in communication interfaces (e.g., I²C, SPI).
• Power supply feedback loops requiring matched resistance ratios.
• Medical and test equipment where stability and tolerance matching are critical.

Conclusion of GS8B032610JDT

The GS8B032610JDT combines high-density integration, exceptional thermal performance, and tight tolerance matching, making it a standout choice for engineers prioritizing reliability in compact designs. Its ceramic construction and thin-film technology deliver long-term stability, while the bussed configuration reduces component count in bus-oriented circuits. Though not RoHS-compliant, it remains a robust solution for industrial, instrumentation, and legacy systems demanding precision and durability.