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GS8B032612JT
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GS8B032612JT Description
GS8B032612JT Description
The GS8B032612JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 resistors with a 26.1KΩ resistance value and a tight ±5% tolerance. Built with thin-film technology, it delivers exceptional stability with a low temperature coefficient of ±25ppm/°C, ensuring reliable performance across a wide temperature range of -70°C to +125°C. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, making it ideal for automated assembly processes. With a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V, this network balances power handling and precision.
GS8B032612JT Features
- High-Density Integration: 15 resistors in a compact 9.91mm × 5.99mm × 1.45mm SOIC package.
- Stable Performance: ±25ppm/°C tempco and 5% tolerance ensure accuracy in varying conditions.
- Robust Construction: Ceramic substrate enhances thermal and mechanical durability.
- Automation-Friendly: Gull-wing leads and 1.27mm pitch simplify PCB assembly.
- Wide Operating Range: Rated for -70°C to +125°C, suitable for industrial environments.
- Bussed Design: Simplifies circuit layout for common bus applications.
GS8B032612JT Applications
This resistor network excels in:
- Analog Signal Conditioning: Precision voltage dividers and sensor interfaces.
- Industrial Control Systems: Stable performance in PLCs and motor drives.
- Medical Electronics: Reliable operation in diagnostic equipment.
- Automotive (Non-Automotive Grade): Auxiliary circuits where high-temperature stability is critical.
- Test & Measurement Equipment: Low-drift resistance networks for calibration.
Conclusion of GS8B032612JT
The GS8B032612JT stands out for its ceramic-based reliability, tight tolerance, and thermal stability, making it a superior choice for precision analog designs. While not PPAP or automotive-qualified, its thin-film technology and bussed architecture offer a cost-effective solution for industrial and instrumentation applications requiring consistent performance under thermal stress. Engineers will appreciate its balance of density, power handling, and ease of integration in space-constrained PCBs.



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