TT Electronics/IRC

GS8B032670CCT

GS8B032670CCT Description

The GS8B032670CCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring stable performance under varying thermal conditions. This 16-pin narrow SOIC device features 15 bussed resistors with a 267Ω resistance value, offering an absolute tolerance of ±0.25% and a ratio tolerance of ±0.25%. Built with thin-film technology, it ensures low noise and excellent long-term stability. The SOIC package (9.91mm × 5.99mm × 1.45mm) with gull-wing terminations facilitates easy surface-mount assembly, while its ceramic case enhances thermal and mechanical durability. Rated for 0.05W per resistor (0.8W total), it operates across a wide temperature range of -70°C to +125°C, with a ±25ppm/°C temperature coefficient for minimal drift.

GS8B032670CCT Features

• Precision Performance: ±0.25% tolerance and ±25ppm/°C TCR ensure accuracy in critical circuits.
• Robust Construction: Ceramic substrate and thin-film technology provide reliability in harsh environments.
• High-Density Integration: 15 bussed resistors in a compact SOIC-16 package save PCB space.
• Wide Operating Range: Supports -70°C to +125°C with derated power up to 125°C.
• Low Noise & Stability: Ideal for analog signal conditioning and precision voltage division.
• Automotive-Grade Alternatives: While not PPAP-certified, its rugged design suits industrial and telecom applications.

GS8B032670CCT Applications

This resistor network excels in:

• Precision Voltage Dividers: Used in sensor interfaces and ADC/DAC reference circuits.
• Bus Termination Networks: Ensures signal integrity in high-speed digital systems (e.g., memory buses).
• Industrial Control Systems: Stable performance in PLCs, motor drives, and power management.
• Test & Measurement Equipment: Low TCR minimizes calibration drift in instrumentation.
• Aerospace & Defense: Ceramic construction withstands thermal cycling and vibration.

Conclusion of GS8B032670CCT

The GS8B032670CCT combines precision, durability, and compactness, making it a superior choice for applications demanding tight tolerance and thermal stability. Its bussed configuration simplifies circuit design, while the ceramic SOIC package ensures reliability in challenging conditions. Though not automotive-qualified, it is ideal for industrial, telecom, and high-reliability systems where consistent performance is critical. Engineers will appreciate its balance of high-density integration and low thermal drift, reducing the need for additional calibration or compensation components.