TT Electronics/IRC

GS8B032670GGT

GS8B032670GGT Description

The GS8B032670GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 267Ω resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. The SOIC package (9.91mm x 5.99mm x 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for reliable PCB connections. Rated for 100V maximum voltage and 0.8W total power dissipation, it operates reliably within a 70°C to 125°C derated power range.

GS8B032670GGT Features

• Ceramic substrate for enhanced thermal and mechanical stability.
• 15 bussed resistors in a 16-pin SOIC package, reducing board space.
• Thin-film technology ensures precision (±2% tolerance) and low TCR (±25ppm/°C).
• 0.05W power rating per resistor (0.8W total) with 100V max voltage rating.
• Surface-mount design with 1.27mm terminal pitch for easy PCB integration.
• Wide operating temperature range (-55°C to +125°C) for harsh environments.
• Non-automotive and non-PPAP compliant, suited for industrial/consumer applications.

GS8B032670GGT Applications

This resistor network excels in:

• Signal conditioning and voltage division in analog circuits.
• Bus termination for digital systems requiring stable impedance matching.
• Precision instrumentation (e.g., sensors, data acquisition) due to low TCR.
• Power management modules where space-efficient, high-density resistor arrays are critical.
• Industrial control systems demanding reliability under thermal stress.

Conclusion of GS8B032670GGT

The GS8B032670GGT combines precision, compactness, and thermal resilience, making it a standout choice for high-density PCB designs requiring stable resistance networks. Its ceramic construction, thin-film accuracy, and bussed configuration offer superior performance over standard thick-film arrays. While not suited for automotive use, it is ideal for industrial, telecom, and consumer electronics where space and reliability are paramount.