TT Electronics/IRC

GS8B032672GBT

GS8B032672GBT Description

The GS8B032672GBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration device integrates 15 thin-film resistors, each with a 26.7KΩ resistance and a tight ±2% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures stability across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction offers 0.05W (1/20) power rating per resistor and a total power rating of 0.8W, with a 100V maximum voltage rating. The gull-wing termination and surface-mount design facilitate automated assembly, while the ceramic case enhances durability and heat dissipation.

GS8B032672GBT Features

• Precision Performance: ±0.1% ratio tolerance and ±2% absolute tolerance for critical signal conditioning.
• Robust Construction: Ceramic substrate with thin-film technology ensures low noise and high reliability.
• Thermal Stability: ±25ppm/°C TCR minimizes resistance drift in variable temperatures.
• Compact & Durable: 9.91mm × 5.99mm × 1.45mm dimensions with ±0.1mm height tolerance for space-constrained PCBs.
• Automation-Friendly: Gull-wing leads and 1.27mm terminal pitch compatible with pick-and-place systems.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and automotive (non-AEC-Q200) applications.

GS8B032672GBT Applications

• Analog Signal Processing: Precision voltage dividers in data acquisition systems.
• Industrial Controls: Feedback networks in motor drives and power supplies.
• Test & Measurement Equipment: Calibration circuits requiring stable resistance ratios.
• Medical Electronics: Low-noise sensor interfaces where thermal drift is critical.
• Telecommunications: Impedance matching in high-frequency modules (despite non-RoHS status).

Conclusion of GS8B032672GBT

The GS8B032672GBT excels in applications demanding high precision, thermal resilience, and compact form factors. Its ceramic thin-film design and bussed architecture provide superior performance over polymer-based networks, particularly in harsh environments. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial and instrumentation designs. Engineers will value its tight tolerances, low TCR, and robust packaging, making it a standout choice for critical analog circuits.