TT Electronics/IRC

GS8B032740GBT

GS8B032740GBT Description

The GS8B032740GBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 274Ω resistance value, offering a ±2% absolute tolerance and an exceptional ±0.1% ratio tolerance. Built with thin-film technology, it ensures low temperature coefficient (±25ppm/°C) and stable performance across a wide temperature range (70°C to 125°C). The SOIC-C series package provides surface-mount compatibility, with a compact footprint (9.91mm × 5.99mm × 1.45mm) and gull-wing termination for reliable PCB integration. Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for high-density circuits requiring precision and durability.

GS8B032740GBT Features

• Ceramic substrate for superior thermal stability and mechanical robustness.
• 15 bussed resistors in a 16-pin SOIC package, optimizing space efficiency.
• Thin-film technology ensures ±25ppm/°C TCR, minimizing resistance drift.
• High power rating (0.8W total, 0.05W per resistor) for demanding applications.
• Tight tolerances: ±2% absolute, ±0.1% ratio, critical for matched circuits.
• Wide operating range: -55°C to +125°C, suitable for industrial environments.
• Gull-wing leads and 1.27mm pitch for easy surface-mount assembly.
• Non-automotive (PPAP No) but suited for precision analog/digital systems.

GS8B032740GBT Applications

• Voltage dividers & precision attenuators in test/measurement equipment.
• Signal conditioning for ADCs/DACs in data acquisition systems.
• Impedance matching networks in RF and communication devices.
• Current-limiting arrays in power management circuits.
• Industrial control systems requiring stable, matched resistances.
• Medical electronics where low drift and reliability are critical.

Conclusion of GS8B032740GBT

The GS8B032740GBT stands out for its ceramic construction, tight tolerances, and thin-film stability, making it a top choice for precision electronics. Its bussed design, high power handling, and compact SOIC package cater to space-constrained, high-reliability applications. While not RoHS-compliant, it excels in industrial, medical, and instrumentation roles where performance outweighs regulatory constraints. Engineers will appreciate its low TCR, matched ratios, and robust packaging for critical circuit designs.