TT Electronics/IRC

GS8B033001FFT

GS8B033001FFT Description

The GS8B033001FFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC (SOIC-C series) device integrates 15 bussed resistors, each with a 3KΩ resistance and a tight ±1% absolute tolerance. Built with thin-film technology, it delivers excellent stability with a low ±25ppm/°C temperature coefficient, ensuring reliable performance across a wide temperature range (70°C to 125°C). The 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits, while its 100V maximum voltage rating enhances versatility. The gull-wing termination and surface-mount design facilitate easy PCB integration.

GS8B033001FFT Features

• Ceramic substrate for superior thermal and mechanical stability.
• Bussed network topology simplifies circuit design in multi-resistor applications.
• Precision thin-film resistors with ±1% tolerance and ±25ppm/°C TCR for high accuracy.
• Compact SOIC package (9.91mm × 5.99mm × 1.45mm) with ±0.1mm length/height tolerances.
• Wide operating temperature range (up to 125°C) for harsh environments.
• Gull-wing leads (1.27mm pitch) ensure robust solder joints and compatibility with automated assembly.
• Non-automotive and non-PPAP compliant, ideal for industrial and consumer electronics.

GS8B033001FFT Applications

This resistor network excels in:

• Voltage dividers and pull-up/pull-down networks in digital systems.
• Signal conditioning circuits for sensors and ADCs.
• Precision analog designs requiring stable resistance ratios (e.g., instrumentation amplifiers).
• Embedded systems where space-saving, multi-resistor integration is critical.
• Industrial control modules demanding reliability under thermal stress.

Conclusion of GS8B033001FFT

The GS8B033001FFT stands out for its ceramic construction, precision thin-film resistors, and compact SOIC footprint, making it a robust choice for high-accuracy, space-constrained applications. Its bussed architecture reduces component count, while the wide temperature range ensures durability. While not suited for automotive use, it is ideal for industrial, medical, and consumer electronics where consistent performance and miniaturization are priorities.