TT Electronics/IRC

GS8B033161GBT

GS8B033161GBT Description

The GS8B033161GBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration integrates 15 thin-film resistors, each with a 3.16KΩ resistance and a tight ±2% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C with a low temperature coefficient of ±25ppm/°C, ensuring stable performance under thermal stress. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-reliability circuits. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, ideal for automated assembly.

GS8B033161GBT Features

• Precision Network: 15 resistors in a bussed (BUS) topology with ±0.1% ratio tolerance for matched performance.
• Robust Construction: Ceramic substrate and thin-film technology deliver high stability and low noise.
• Thermal Resilience: Operates up to 125°C with derated power at elevated temperatures.
• Compact Design: 9.91mm length × 5.99mm depth × 1.45mm height (±0.1mm tolerance) fits space-constrained PCBs.
• Automation-Friendly: Gull-wing leads and 1.27mm terminal pitch simplify surface-mount placement.
• Non-Automotive: Not PPAP-capable or RoHS-compliant, targeting industrial/commercial use.

GS8B033161GBT Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces or ADC/DAC circuits.
• Analog Systems: Matched resistor networks for op-amp feedback or gain control.
• Power Management: Current-limiting or pull-up/pull-down networks in low-power designs.
• Test Equipment: Calibration circuits requiring tight tolerance (±2%) and low TCR (±25ppm/°C).
• Industrial Electronics: Durable ceramic construction suits harsh environments (e.g., control systems).

Conclusion of GS8B033161GBT

The GS8B033161GBT excels in applications demanding precision, thermal stability, and compactness. Its ceramic thin-film design and bussed architecture offer superior performance over polymer-based networks, while the SOIC package ensures compatibility with high-density layouts. Though not suited for automotive use, it is ideal for industrial, instrumentation, and communication systems where reliability and accuracy are critical. Engineers will value its low TCR, tight tolerances, and robust construction for long-term operational integrity.