TT Electronics/IRC

GS8B033161JGT

GS8B033161JGT Description

The GS8B033161JGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 3.16KΩ resistance value and a ±5% absolute tolerance, ensuring reliable performance in demanding environments. Built with thin-film technology, it offers a low temperature coefficient of ±25ppm/°C, making it stable across a wide operating temperature range of -70°C to +125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for secure PCB connections. Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for analog and digital signal conditioning.

GS8B033161JGT Features

• Bussed Network Design: Simplifies circuit layout with 15 resistors connected to a common bus, reducing component count.
• High Precision: ±5% absolute tolerance and ±2% ratio tolerance ensure consistent performance in voltage dividers and sensor interfaces.
• Robust Construction: Ceramic substrate and thin-film technology enhance thermal stability and long-term reliability.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power handling up to 125°C.
• Space-Efficient: Compact SOIC-16 footprint (9.91mm length, 1.27mm pitch) suits high-density PCB designs.
• Low TCR: ±25ppm/°C minimizes resistance drift in temperature-sensitive applications.

GS8B033161JGT Applications

• Industrial Automation: Signal conditioning in PLCs, motor drivers, and instrumentation.
• Telecommunications: Impedance matching and termination in high-speed data lines.
• Medical Electronics: Precision analog circuits in diagnostic equipment.
• Automotive (Non-Safety): Sensor interfaces and control modules (note: not PPAP/AEC-Q200 qualified).
• Test & Measurement: Calibration networks and reference voltage dividers.

Conclusion of GS8B033161JGT

The GS8B033161JGT excels in precision analog circuits where stability, compactness, and simplified routing are critical. Its ceramic thin-film construction and low TCR make it superior to standard thick-film networks in thermal performance. While not automotive-grade, it is a cost-effective solution for industrial, telecom, and medical applications requiring tight tolerance and high reliability. Engineers will appreciate its bussed architecture, reducing BOM complexity without sacrificing accuracy.