TT Electronics/IRC

GS8B033241JT

GS8B033241JT Description

The GS8B033241JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 3.24KΩ resistance value and a ±5% tolerance, ensuring reliable signal conditioning and voltage division. Built with thin-film technology, it offers a low temperature coefficient of ±25ppm/°C, maintaining stability across a wide operating range of -70°C to +125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations ensures compatibility with automated SMT processes. Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for space-constrained designs requiring robust performance.

GS8B033241JT Features

• Bussed Network Design: Simplifies PCB layout with 15 interconnected resistors.
• High Precision: ±5% absolute tolerance and ±25ppm/°C TCR for stable operation.
• Robust Construction: Ceramic substrate enhances thermal and mechanical durability.
• Surface-Mount Ready: Gull-wing terminations and 1.27mm pitch for easy assembly.
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power.
• Compact Footprint: SOIC-C series package optimizes board space.
• Non-Automotive Grade: Suitable for industrial and commercial applications.

GS8B033241JT Applications

This resistor network excels in:

• Signal Conditioning: Voltage division and pull-up/down networks in analog circuits.
• Industrial Controls: PLCs, sensor interfaces, and power management systems.
• Test & Measurement Equipment: Precision dividers and calibration circuits.
• Communication Systems: Line termination and impedance matching.
• Medical Devices: Low-noise, stable resistance paths in diagnostic equipment.

Conclusion of GS8B033241JT

The GS8B033241JT combines high reliability, compact design, and precision performance, making it a standout choice for engineers seeking durable resistor networks. Its ceramic construction and thin-film technology ensure longevity in harsh environments, while the bussed architecture reduces component count. Though not PPAP or RoHS compliant, it remains a cost-effective solution for industrial, telecom, and instrumentation applications demanding tight tolerances and thermal stability.