TT Electronics/IRC

GS8B033300GBT

GS8B033300GBT Description

The GS8B033300GBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 16-pin Narrow SOIC device features 15 bussed resistors with a 330Ω resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. The SOIC package (9.91mm × 5.99mm × 1.45mm) provides a compact footprint, while the gull-wing termination ensures reliable surface-mount assembly. With a power rating of 0.8W (0.05W per resistor) and a maximum operating temperature of 125°C, this network is engineered for durability in industrial and commercial applications.

GS8B033300GBT Features

• Ceramic Case & Thin-Film Tech: Ensures high reliability and thermal stability.
• Bussed Network (15 Resistors): Simplifies circuit design with shared connections.
• Precision Tolerance: ±2% absolute, ±0.1% ratio tolerance for matched performance.
• Low TCR (±25ppm/°C): Minimizes resistance drift across temperature ranges (70°C to 125°C).
• High Voltage Rating (100V): Suitable for robust signal and power applications.
• Compact SOIC Package: Space-saving 16-pin design with 1.27mm terminal pitch.
• Surface-Mount Ready: Gull-wing terminals for automated PCB assembly.

GS8B033300GBT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and sensor interfaces.
• Industrial Control Systems: Stable performance in harsh environments.
• Medical Electronics: Reliable operation in diagnostic and monitoring equipment.
• Automotive Modules (non-Automotive PPAP): Auxiliary circuits where temperature resilience is critical.
• Test & Measurement Equipment: Low-drift resistance for calibration and feedback loops.

Conclusion of GS8B033300GBT

The GS8B033300GBT stands out for its ceramic construction, tight tolerances, and thermal stability, offering superior performance over plastic-encased networks. Its bussed design reduces component count, while the SOIC package ensures compatibility with high-density PCBs. Though not PPAP-capable or RoHS-compliant, it remains a top choice for engineers prioritizing precision and durability in industrial, medical, and instrumentation applications. For designs requiring stable, matched resistors in a compact form factor, this network delivers exceptional value.