TT Electronics/IRC

GS8B033322JGT

GS8B033322JGT Description

The GS8B033322JGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values and reliable thermal performance. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 resistors with a 33.2KΩ value per element, offering an absolute tolerance of ±5% and a ratio tolerance of ±2%. Its thin-film technology ensures low noise and excellent stability, while the ±25ppm/°C temperature coefficient guarantees minimal resistance drift across a wide operating range of -70°C to +125°C. With a power rating of 0.8W (0.05W per resistor) and a maximum voltage rating of 100V, it is engineered for demanding surface-mount applications.

GS8B033322JGT Features

• Ceramic Construction: Ensures superior thermal conductivity and mechanical durability.
• Bussed Network Design: Simplifies PCB layout by reducing component count.
• Precision Thin Film: Delivers ±25ppm/°C thermal stability and low parasitic effects.
• High Power Handling: 0.8W total (0.05W per resistor) supports robust operation.
• Wide Temperature Range: Operates reliably from -70°C to +125°C.
• Gull Wing Termination: Facilitates surface-mount (SMD) assembly with a 1.27mm pitch.
• Compact Footprint: 9.91mm x 5.99mm x 1.45mm (LxDxH) saves board space.
• Non-Automotive Grade: Suitable for industrial and commercial applications.

GS8B033322JGT Applications

This resistor network is ideal for:

• Voltage Divider Circuits: Precision ratio tolerance (±2%) ensures accurate signal conditioning.
• Analog Signal Processing: Low noise and stability enhance ADC/DAC performance.
• Power Supply Feedback Networks: Reliable operation under derated power conditions.
• Industrial Control Systems: Withstands harsh environments due to ceramic construction.
• Test & Measurement Equipment: High tolerance and thermal stability critical for calibration.

Conclusion of GS8B033322JGT

The GS8B033322JGT excels in applications demanding precision, thermal resilience, and space efficiency. Its ceramic substrate, bussed architecture, and thin-film technology provide a competitive edge over polymer-based networks, particularly in high-temperature or high-reliability scenarios. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial, telecom, and instrumentation designs requiring stable, low-drift resistance networks.