TT Electronics/IRC

GS8B033402FDT

GS8B033402FDT Description

The GS8B033402FDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. Housed in a 16-pin narrow SOIC package, this bussed (BUS) configuration device integrates 15 thin-film resistors, each with a 34KΩ resistance and a tight ±1% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures stable performance across a wide operating range of -55°C to +125°C, with derated power handling up to 125°C. The 0.05W (1/20W) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits requiring reliability and precision. The 100V maximum voltage rating and 1.27mm terminal pitch further enhance its versatility in compact designs.

GS8B033402FDT Features

• Ceramic substrate for superior thermal stability and durability.
• Thin-film technology delivers high accuracy (±1%) and low TCR (±25ppm/°C).
• Bussed (BUS) topology simplifies circuit design by interconnecting resistors.
• Narrow SOIC (SOIC-C) package (9.91mm x 5.99mm x 1.45mm) optimizes PCB space.
• Gull-wing termination ensures reliable surface-mount soldering.
• Wide temperature range (-55°C to +125°C) with derated performance up to 125°C.
• Low power dissipation (0.05W/resistor) ideal for energy-sensitive applications.
• Non-automotive grade (PPAP: No), suited for industrial and commercial use.

GS8B033402FDT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage dividers and signal conditioning in sensor interfaces.
• Pull-up/pull-down networks for microcontrollers and FPGAs.
• Impedance matching in communication systems.
• Medical instrumentation requiring stable, low-drift resistance.
• Test and measurement equipment where ratio tolerance (±0.5%) is critical.

Conclusion of GS8B033402FDT

The GS8B033402FDT combines high precision, compact form factor, and robust ceramic construction, making it a standout choice for engineers prioritizing reliability in tight-tolerance designs. Its bussed architecture reduces component count, while thin-film technology ensures long-term stability. While not RoHS-compliant, it remains a top-tier solution for industrial, medical, and communication systems demanding uncompromising performance.