TT Electronics/IRC

GS8B033650DBT

GS8B033650DBT Description

The GS8B033650DBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Packaged in a 16-pin narrow SOIC (SOIC-C series), this bussed network integrates 15 resistors with a 365Ω resistance value and an absolute tolerance of ±0.5%, ensuring exceptional accuracy. Its thin-film technology and ±25ppm/°C temperature coefficient deliver stable performance across a wide temperature range (70°C to 125°C). With a 0.05W (1/20) power rating per resistor and 0.8W total power dissipation, it balances compactness with reliability. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical durability.

GS8B033650DBT Features

• Precision Performance: ±0.5% absolute tolerance and ±0.1% ratio tolerance for critical analog/digital circuits.
• Robust Construction: Ceramic substrate ensures high thermal stability and low parasitic effects.
• Space-Efficient: Compact 9.91mm × 5.99mm × 1.45mm footprint (SOIC package) ideal for dense layouts.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and instrumentation use.
• Temperature Resilience: Operates reliably from -55°C to +125°C (derated power up to 125°C).
• Automation-Friendly: Tube packaging and 1.27mm terminal pitch streamline pick-and-place assembly.

GS8B033650DBT Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers in ADCs/DACs and sensor interfaces.
• Industrial Controls: Feedback networks in PLCs and motor drives requiring low drift.
• Medical Electronics: Stable reference circuits in diagnostic equipment.
• Telecom Infrastructure: Impedance matching in high-frequency RF modules.
• Automotive (Non-Automotive Rated): Secondary circuits where ceramic durability is prioritized.

Conclusion of GS8B033650DBT

The GS8B033650DBT stands out for its combination of precision, compactness, and ceramic ruggedness, making it a superior choice for applications demanding tight tolerances and thermal reliability. While not PPAP or automotive-qualified, its thin-film technology and bussed architecture cater to industrial, medical, and telecom needs where component consistency is critical. Engineers will appreciate its balance of performance and manufacturability in space-constrained, high-reliability designs.