TT Electronics/IRC

GS8B033651JAT

GS8B033651JAT Description

The GS8B033651JAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors, each with a 3.65KΩ resistance and a ±5% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C with a low temperature coefficient of ±25ppm/°C, ensuring stable performance under thermal stress. Its 0.05W (1/20) power rating per resistor and 0.8W total power rating make it suitable for low-power circuits, while the 100V maximum voltage rating adds versatility. The SOIC-C series construction features gull-wing terminations for reliable surface-mount assembly, with tight dimensional tolerances (±0.1mm height, ±0.2mm depth) ensuring compatibility with automated PCB processes.

GS8B033651JAT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology delivers precision (±5% tolerance, ±0.05% ratio tolerance) and low noise.
• Bussed circuit design simplifies PCB layout by reducing discrete component count.
• Wide operating range: -55°C to +125°C (derated power at 70°C+).
• Compact footprint: 9.91mm (L) × 5.99mm (D) × 1.45mm (H), ideal for space-constrained designs.
• RoHS non-compliant (note for legacy or exempted applications).
• Tube packaging for safe handling and storage.

GS8B033651JAT Applications

This resistor network excels in:

• Analog signal conditioning (e.g., voltage dividers, sensor interfaces).
• Industrial control systems requiring stable resistance under thermal cycling.
• Medical electronics where precision and reliability are critical.
• Automotive subsystems (non-AECQ qualified; suitable for non-safety-critical functions).
• Test and measurement equipment leveraging its low TCR and tight ratio tolerance.

Conclusion of GS8B033651JAT

The GS8B033651JAT combines precision, compactness, and robustness, making it a standout choice for engineers designing high-density, thermally challenging circuits. While not automotive-grade or RoHS-compliant, its ceramic construction and thin-film technology offer superior performance in industrial, medical, and instrumentation applications. Its bussed architecture reduces BOM complexity, while the SOIC package ensures compatibility with standard assembly processes. For designs demanding stable resistance with minimal drift, this network delivers exceptional value.