TT Electronics/IRC

GS8B033831GT

GS8B033831GT Description

The GS8B033831GT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 16-pin narrow SOIC package, this bussed network integrates 15 thin-film resistors with a 3.83KΩ resistance value and a tight ±2% tolerance. The device operates over a wide temperature range (-70°C to +125°C) with a low temperature coefficient of ±25ppm/°C, ensuring stable performance under thermal stress. Its SOIC-C series construction offers 0.05W (1/20) power rating per resistor and a total power rating of 0.8W, making it suitable for compact, high-density PCB designs.

GS8B033831GT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology delivers precision and low noise.
• Bussed circuit design simplifies routing in bus-oriented systems.
• Gull-wing termination ensures reliable surface-mount assembly.
• 100V maximum voltage rating and 125°C max operating temperature for robust performance.
• Compact dimensions (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• Non-automotive (PPAP No) and EU RoHS non-compliant, ideal for industrial/commercial use.

GS8B033831GT Applications

This resistor network excels in:

• Analog/digital signal conditioning in test/measurement equipment.
• Voltage division/current limiting in power management circuits.
• Bus termination/pull-up networks for communication interfaces (I2C, SPI).
• High-reliability industrial systems where thermal drift resistance is critical.
• Space-constrained designs (e.g., medical devices, aerospace avionics) due to its SOIC footprint.

Conclusion of GS8B033831GT

The GS8B033831GT stands out for its precision, thermal resilience, and compact form factor, making it a superior choice for engineers prioritizing stability in harsh environments. While not RoHS-compliant, its ceramic construction and thin-film technology offer long-term reliability for industrial and commercial applications. Its bussed architecture reduces component count, streamlining designs in bus-centric systems. For projects requiring tight-tolerance, high-temperature operation, this network delivers unmatched performance.