TT Electronics/IRC

GS8B034021FT

GS8B034021FT Description

The GS8B034021FT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 4.02KΩ resistance value and a tight ±1% absolute tolerance, ensuring reliable performance in precision circuits. Built with thin-film technology, it offers excellent stability with a low temperature coefficient of ±25ppm/°C, making it suitable for environments with fluctuating thermal conditions. The SOIC package (9.91mm × 5.99mm × 1.45mm) provides a compact footprint for surface-mount applications, while its ceramic construction enhances durability and heat dissipation. Rated for 0.05W (1/20) per resistor and 0.8W total power, it operates within a -70°C to +125°C temperature range, with a maximum voltage rating of 100V.

GS8B034021FT Features

• Bussed Network Design: Simplifies PCB layout by reducing discrete component count.
• High Precision: ±1% tolerance and ±25ppm/°C TCR ensure stable performance.
• Robust Construction: Ceramic substrate enhances thermal and mechanical reliability.
• Compact SOIC Package: Ideal for space-constrained designs (9.91mm × 5.99mm × 1.45mm).
• Wide Temperature Range: Operates from -70°C to +125°C with derated power up to 125°C.
• Thin-Film Technology: Delivers low noise and high accuracy for sensitive circuits.
• Gull Wing Termination: Ensures secure surface-mount soldering.

GS8B034021FT Applications

• Voltage Divider Networks: Precision signal conditioning in measurement systems.
• Bus Termination: Stabilizes high-speed digital lines (e.g., SPI, I²C).
• Industrial Controls: Reliable performance in harsh environments (e.g., motor drives, PLCs).
• Medical Electronics: Low-noise, high-stability requirements in diagnostic equipment.
• Automotive (Non-Automotive Grade): Secondary circuits where PPAP compliance is not critical.

Conclusion of GS8B034021FT

The GS8B034021FT excels in applications requiring compact size, precision, and thermal stability. Its ceramic thin-film construction and bussed network topology reduce design complexity while maintaining high reliability. Though not PPAP or automotive-grade, it is well-suited for industrial, medical, and instrumentation uses where consistent performance under thermal stress is paramount. Engineers will appreciate its balance of precision, power handling, and space efficiency in advanced PCB designs.