TT Electronics/IRC

GS8B034021GFT

GS8B034021GFT Description

The GS8B034021GFT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 16-pin Narrow SOIC device features 15 bussed resistors with a 4.02KΩ resistance value and a tight ±2% absolute tolerance, ensuring consistent performance. Built with thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. The SOIC-C series package provides robust mechanical durability, with a compact footprint (9.91mm × 5.99mm × 1.45mm) and gull-wing termination for reliable surface-mount assembly. Rated for 100V maximum voltage and 0.05W (1/20) power per resistor, it operates efficiently across a 70°C to 125°C derated power range, with a 125°C maximum operating temperature.

GS8B034021GFT Features

• High Precision: ±2% absolute tolerance and ±1% ratio tolerance for critical circuit matching.
• Stable Performance: Low ±25ppm/°C TCR ensures minimal resistance drift under thermal stress.
• Robust Construction: Ceramic case and thin-film technology enhance reliability in harsh conditions.
• Compact Design: 16-pin SOIC package (9.91mm × 5.99mm × 1.45mm) saves board space.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive applications (though not PPAP/automotive-certified).
• Surface-Mount Ready: Gull-wing terminals simplify PCB assembly.

GS8B034021GFT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage dividers and sensor interfaces where ratio tolerance (±1%) is critical.
• Signal conditioning in test/measurement equipment.
• Industrial control systems requiring stable performance at elevated temperatures.
• Medical devices benefiting from low TCR and high reliability.
• Telecommunications infrastructure where space-efficient, high-density components are prioritized.

Conclusion of GS8B034021GFT

The GS8B034021GFT combines precision, stability, and compactness, making it a superior choice for engineers designing high-reliability systems. Its ceramic construction, thin-film technology, and tight tolerances address challenges in thermal management and signal integrity, while the SOIC package ensures compatibility with modern SMT processes. Though not automotive-grade, its performance metrics align with industrial, medical, and telecom needs where accuracy and durability are paramount.