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GS8B034021JAT
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GS8B034021JAT Description
GS8B034021JAT Description
The GS8B034021JAT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 4.02KΩ resistance value and a ±5% absolute tolerance, ensuring reliable signal distribution in complex circuits. Built with thin-film technology, it offers a low ±25ppm/°C temperature coefficient, enhancing stability across a wide operating temperature range of -70°C to +125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations ensures compatibility with automated surface-mount assembly processes. Rated for 100V maximum voltage and 0.8W total power dissipation, it is ideal for high-density PCB designs requiring consistent performance under thermal stress.
GS8B034021JAT Features
- Bussed Network Design: Simplifies circuit layout by connecting multiple resistors to a common node (BUS).
- High Precision: ±5% tolerance and ±0.05% ratio tolerance for matched resistance values.
- Robust Construction: Ceramic substrate ensures durability and thermal stability.
- Low TCR: ±25ppm/°C minimizes resistance drift in varying environments.
- Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads for easy PCB integration.
- Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive-grade applications (though not PPAP/automotive certified).
GS8B034021JAT Applications
This resistor network excels in:
- Voltage Divider Networks: Precision signal conditioning in sensor interfaces.
- Bus Termination: Impedance matching in high-speed digital circuits (e.g., SPI, I²C).
- Analog Signal Processing: Stable performance in op-amp feedback networks.
- Power Management: Current limiting in low-power DC/DC converters.
- Industrial Controls: Reliable operation in harsh environments (e.g., motor drives, PLCs).
Conclusion of GS8B034021JAT
The GS8B034021JAT combines precision, durability, and compactness, making it a versatile choice for engineers designing high-reliability electronics. Its thin-film ceramic construction and low TCR outperform standard thick-film networks, while the bussed architecture reduces component count. Though not RoHS-compliant or automotive-rated, it remains a cost-effective solution for industrial, telecom, and instrumentation applications demanding stable resistance values under thermal and electrical stress.



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