TT Electronics/IRC

GS8B034320GT

GS8B034320GT Description

The GS8B034320GT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 432Ω resistance value and a tight ±2% tolerance, ensuring reliable performance in demanding circuits. Built with thin-film technology, it offers excellent stability with a low ±25ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. The SOIC package (9.91mm × 5.99mm × 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for robust PCB connectivity. Rated for 100V maximum voltage and 0.8W total power dissipation, it operates across a -70°C to +125°C range, suitable for industrial and instrumentation use.

GS8B034320GT Features

• Ceramic substrate for superior thermal and mechanical stability.
• Bussed network (BUS) simplifies circuit design with shared node configuration.
• 0.05W (1/20) power rating per resistor ensures balanced load distribution.
• ±0.1mm height/length tolerances for precise PCB alignment.
• Non-automotive (PPAP No) but excels in industrial, telecom, and test equipment.
• EAR99 ECCN for unrestricted global export (excludes military/space).
• Tube packaging for safe handling and automated placement.

GS8B034320GT Applications

This resistor network is tailored for:

• Voltage divider circuits in precision analog systems.
• Pull-up/pull-down arrays in digital logic interfaces.
• Signal conditioning for sensors and ADCs in harsh environments.
• Power supply feedback networks requiring low TCR drift.
• Embedded systems where space-efficient, high-density resistor arrays are critical.

Conclusion of GS8B034320GT

The GS8B034320GT stands out for its ceramic construction, tight tolerances, and bussed topology, offering engineers a reliable solution for space-constrained, high-stability designs. While not RoHS-compliant, its wide temperature range and low TCR make it a robust choice for industrial and precision electronics. Its SOIC footprint ensures compatibility with standard SMT processes, reducing assembly complexity. For applications demanding repeatable performance under thermal stress, this network delivers unmatched consistency.