TT Electronics/IRC

GS8B034701JT

GS8B034701JT Description

The GS8B034701JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 16-pin narrow SOIC package features 15 bussed resistors with a 4.7KΩ resistance value and a ±5% tolerance, ensuring reliable signal integrity in compact designs. Built with thin-film technology, it offers a low temperature coefficient (±25ppm/°C) and operates across a wide temperature range (70°C to 125°C), making it suitable for environments with thermal fluctuations. The SOIC-C series construction provides robust mechanical stability, while the gull-wing termination ensures secure surface-mount attachment. With a maximum voltage rating of 100V and a power rating of 0.8W (0.05W per resistor), this network balances efficiency and durability.

GS8B034701JT Features

• Ceramic case for enhanced thermal and mechanical resilience.
• 15 bussed resistors in a 16-pin SOIC package, optimizing space in dense PCB layouts.
• Thin-film technology ensures precision (±5% tolerance) and stability (±25ppm/°C).
• Wide operating range: -70°C to +125°C (derated power).
• Surface-mount (SMD) design with gull-wing leads for reliable soldering.
• Low-profile form factor: 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).
• 100V maximum voltage rating and 0.8W total power dissipation.
• Non-automotive and non-PPAP compliant, ideal for industrial and commercial use.

GS8B034701JT Applications

This resistor network excels in:

• Signal conditioning and voltage division in analog/digital hybrid circuits.
• Bus termination for communication interfaces (e.g., I²C, SPI).
• Power supply decoupling and impedance matching in RF/mixed-signal PCBs.
• Industrial control systems requiring stable resistance under thermal stress.
• Medical electronics where precision and compactness are critical.

Conclusion of GS8B034701JT

The GS8B034701JT stands out for its ceramic-based durability, thin-film accuracy, and space-saving SOIC footprint. While not RoHS-compliant, its high-temperature performance and bussed architecture make it a pragmatic choice for engineers prioritizing reliability in harsh environments. Ideal for embedded systems, test equipment, and telecom infrastructure, this network combines technical rigor with cost-effective packaging.