TT Electronics/IRC

GS8B034872GFT

GS8B034872GFT Description

The GS8B034872GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 16-pin narrow SOIC device features 15 bussed resistors with a 48.7KΩ resistance value and a tight ±2% absolute tolerance, ensuring reliable signal integrity. Built with thin-film technology, it offers a low ±25ppm/°C temperature coefficient, making it stable across a wide operating temperature range of -70°C to +125°C. The SOIC package (9.91mm x 5.99mm x 1.45mm) with gull-wing terminations ensures easy surface-mount assembly, while its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating suit demanding circuit environments.

GS8B034872GFT Features

• Bussed Network Design: Simplifies PCB layout with 15 interconnected resistors.
• High Precision: ±2% tolerance and ±25ppm/°C thermal stability for critical applications.
• Robust Construction: Ceramic substrate enhances durability and heat dissipation.
• Compact SOIC Package: Space-saving 16-pin narrow profile (1.27mm pitch).
• Wide Temperature Range: Reliable performance from -70°C to +125°C.
• Surface-Mount Ready: Gull-wing terminations for automated assembly.
• Low Power Dissipation: 0.05W per resistor, 0.8W total power rating.

GS8B034872GFT Applications

Ideal for precision analog and digital circuits, the GS8B034872GFT excels in:

• Voltage Divider Networks: Stable ratios (±1% tolerance) for sensor interfaces.
• Signal Conditioning: Low-noise performance in data acquisition systems.
• Industrial Controls: Reliable operation in harsh environments (e.g., motor drives).
• Medical Electronics: Consistent accuracy in diagnostic equipment.
• Automotive Systems (non-AECQ): Non-critical ECU signal paths (note: not PPAP/automotive-rated).

Conclusion of GS8B034872GFT

The GS8B034872GFT combines precision, compactness, and thermal resilience, making it a standout choice for engineers needing reliable resistor networks in space-constrained, high-temperature designs. Its thin-film technology and bussed architecture reduce component count while maintaining signal fidelity, ideal for industrial, medical, and instrumentation applications. For non-automotive projects requiring stable performance under thermal stress, this model delivers exceptional value.